集成电路高精度晶圆测温技术研究

王光耀; 孙建平; 李婷; 汪洪军; 李嘉豪; 陈泽川; 高传吉

doi:10.12338/j.issn.2096-9015.2022.0263

集成电路高精度晶圆测温技术研究

doi: 10.12338/j.issn.2096-9015.2022.0263

1.
中国计量科学研究院，北京 100029
2.
中国计量大学，杭州 310018

基金项目: 中国计量科学研究院基本科研业务费重点领域项目（26-AKYZD2004-3）。

详细信息

作者简介:
王光耀（1990-），中国计量科学研究院助理研究员，研究方向：温度计量，邮箱：wanggy@nim.ac.cn

通讯作者:
孙建平（1978-），中国计量科学研究院研究员，研究方向：温度计量，邮箱：sunjp@nim.ac.cn

中图分类号: TB942
计量
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出版历程
- 收稿日期: 2022-11-04
- 录用日期: 2022-12-01
- 修回日期: 2023-03-10
- 网络出版日期: 2023-03-13

Research on High-Precision Temperature Measurement Techniques for Integrated Circuits

1.
National Institute of Metrology, Beijing 100029, China
2.
China Jiliang University, Hangzhou 310018, China

摘要

摘要: 集成电路从硅片制造、电路设计、晶圆加工、封装直到出厂存在近千道工艺，温度始终贯穿其中，温度的精密测量已成为不可或缺的关键技术。针对我国“缺芯少魂”的芯片产业发展困境及集成电路领域对于精密测温的迫切需求，展开传感器选型、长期稳定性考察及标定方法研究，发展多通道高精度测温电路技术，形成测温晶圆标定方法，研制了一套33路有线高精度晶圆温度测量系统。测试结果表明，NTC热敏电阻温度计能够满足高精度晶圆测温需求；拟合温度点的选取对于标定结果具有较大影响，通过不同标定温度点数量及分布的拟合结果比较，最终选取六点拟合，实现了21℃～23℃范围内偏差小于3 mK，测量不确定度7.4 mK（k=2）的结果。
- 计量学 /
- 集成电路 /
- 晶圆 /
- NTC热敏电阻 /
- 温度测量 /
- 不确定度
Abstract: The process of integrated circuit fabrication spans from silicon wafer manufacturing, circuit designing, wafer processing, packaging to the final product, involving nearly a thousand steps where precision temperature control plays a pivotal role. Given the pressing demand for precise temperature measurements in integrated circuit production and the current challenges faced by China's chip industry, this study investigated sensor selection, long-term stability, and calibration methods. Consequently, a multi-channel high-precision temperature measurement circuit technology was developed and a calibration method for temperature measurement wafers was established. Further, a 33-channel wired high-precision wafer temperature measurement system was constructed. Experimental results demonstrate that the NTC thermistor thermometer can satisfy the requirements of high-precision wafer temperature measurements. Calibration results greatly depend on the selection of fitting temperature points. Through comparison of different calibration temperature point distributions and quantities, a six-point fitting was chosen, achieving a deviation less than 3 mK within a 21℃~23℃ range, and measurement uncertainty of 7.4 mK (k=2).
- metrology /
- integrated circuit /
- wafer /
- NTC thermistor /
- temperature measurement /
- uncertainty

HTML全文

图 1 NTC热敏电阻半年稳定性结果

Figure 1. Half-year stability results of NTC thermistor

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图 2 NTC热敏电阻校准系统

Figure 2. Calibration system of NTC thermistor

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图 3 电路稳定性测试系统

Figure 3. Circuit stability test system

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图 4 温度传感器分布图

Figure 4. Distribution diagram of temperature sensors

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图 5 测温晶圆标定示意图

Figure 5. Schematic diagram of temperature

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图 6 系统开启后温度随时间变化

Figure 6. Temperature variation over time after system activation

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图 7 在10 ℃、21 ℃、23 ℃、30 ℃温度点校准结果验证

Figure 7. Verification of calibration results at temperature points of 10 ℃, 21 ℃, 23 ℃, and 30 ℃

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表 1 晶圆测温系统测温不确定度

Table 1. Uncertainty of temperature measurement in wafer temperature measurement system

不确定度来源	标准不确定度 / mK（21℃~23℃）
多通道精密测温仪	1.4
NTC热敏电阻温度计稳定性	2.3
恒温槽稳定性、均匀性	1.7
多次测量重复性	1.7
SPRT校准	0.3
合成标准不确定度	3.6
扩展不确定度（k=2）	7.2

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