Abstract: The process of integrated circuit fabrication spans from silicon wafer manufacturing, circuit designing, wafer processing, packaging to the final product, involving nearly a thousand steps where precision temperature control plays a pivotal role. Given the pressing demand for precise temperature measurements in integrated circuit production and the current challenges faced by China's chip industry, this study investigated sensor selection, long-term stability, and calibration methods. Consequently, a multi-channel high-precision temperature measurement circuit technology was developed and a calibration method for temperature measurement wafers was established. Further, a 33-channel wired high-precision wafer temperature measurement system was constructed. Experimental results demonstrate that the NTC thermistor thermometer can satisfy the requirements of high-precision wafer temperature measurements. Calibration results greatly depend on the selection of fitting temperature points. Through comparison of different calibration temperature point distributions and quantities, a six-point fitting was chosen, achieving a deviation less than 3 mK within a 21℃~23℃ range, and measurement uncertainty of 7.4 mK (k=2).