Research on High Precision Wafer Temperature Measurement Technology for Integrated Circuit
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摘要: 集成电路从硅片制造、电路设计、晶圆加工、封装直到出厂存在近千道工艺,温度始终贯穿其中,温度的精密测量已成为不可或缺的关键技术。针对我国“缺芯少魂”的芯片产业发展困境及集成电路领域对于精密测温的迫切需求,展开传感器选型、长期稳定性考察及标定方法研究,发展多通道高精度测温电路技术,形成测温晶圆标定方法,研制了一套33路有线高精度晶圆温度测量系统。测试结果表明,NTC热敏电阻温度计能够满足高精度晶圆测温需求;拟合温度点的选取对于标定结果具有较大影响,通过不同标定温度点数量及分布的拟合结果比较,最终选取六点拟合,实现了21℃~23℃范围内偏差小于3 mK,测量不确定度7.4 mK(k=2)的结果。Abstract: Integrated circuit technology includes nearly a thousand processes from wafer manufacturing, circuit design, wafer processing, packaging to delivery. Precision measurement of temperature has become an indispensable technology in these processes. This paper focuses on the development dilemma of China's chip industry and the urgent need for precise temperature measurement in the field of integrated circuits. Sensor selection, long-term stability investigation and calibration method are studied. The multi-channel high-precision acquisition and control circuit technology has been developed. A calibration method of temperature measurement wafer is formed. A 33-channel wired high precision wafer temperature measurement system is developed. The results show that the NTC thermistor thermometer can meet the demand of high precision wafer temperature measurement. The selection of fitting temperature points has a great influence on the calibration results. By comparing the fitting results of the number and distribution of different calibration temperature points, six temperature points were finally selected for fitting, and the deviation in the range of 21℃~23℃ was less than 3 mK, and the measurement uncertainty was 7.4 mK (k=2).
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Key words:
- integrated circuit /
- wafer /
- NTC thermistor /
- temperature measurement /
- uncertainty
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表 1 晶圆测温系统测温不确定度
Table 1. Temperature measurement uncertainty of wafer temperature measurement system
不确定度来源 标准不确定度 / mK
(21℃~23℃)多通道精密测温仪 1.4 NTC热敏电阻温度计稳定性 2.3 恒温槽稳定性、均匀性 1.7 多次测量重复性 1.7 SPRT校准 0.3 合成标准不确定度 3.6 扩展不确定度(k=2) 7.2 -
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