Volume 67 Issue 4
Apr.  2023
Turn off MathJax
Article Contents
WANG Guangyao, SUN Jianping, LI Ting, WANG Hongjun, LI Jiahao, CHEN Zechuan, GAO Chuanji. Research on High-Precision Temperature Measurement Techniques for Integrated Circuits[J]. Metrology Science and Technology, 2023, 67(4): 77-82, 27. doi: 10.12338/j.issn.2096-9015.2022.0263
Citation: WANG Guangyao, SUN Jianping, LI Ting, WANG Hongjun, LI Jiahao, CHEN Zechuan, GAO Chuanji. Research on High-Precision Temperature Measurement Techniques for Integrated Circuits[J]. Metrology Science and Technology, 2023, 67(4): 77-82, 27. doi: 10.12338/j.issn.2096-9015.2022.0263

Research on High-Precision Temperature Measurement Techniques for Integrated Circuits

doi: 10.12338/j.issn.2096-9015.2022.0263
  • Received Date: 2022-11-04
  • Accepted Date: 2022-12-01
  • Rev Recd Date: 2023-03-10
  • Available Online: 2023-03-13
  • Publish Date: 2023-04-18
  • The process of integrated circuit fabrication spans from silicon wafer manufacturing, circuit designing, wafer processing, packaging to the final product, involving nearly a thousand steps where precision temperature control plays a pivotal role. Given the pressing demand for precise temperature measurements in integrated circuit production and the current challenges faced by China's chip industry, this study investigated sensor selection, long-term stability, and calibration methods. Consequently, a multi-channel high-precision temperature measurement circuit technology was developed and a calibration method for temperature measurement wafers was established. Further, a 33-channel wired high-precision wafer temperature measurement system was constructed. Experimental results demonstrate that the NTC thermistor thermometer can satisfy the requirements of high-precision wafer temperature measurements. Calibration results greatly depend on the selection of fitting temperature points. Through comparison of different calibration temperature point distributions and quantities, a six-point fitting was chosen, achieving a deviation less than 3 mK within a 21℃~23℃ range, and measurement uncertainty of 7.4 mK (k=2).
  • loading
  • [1]
    MACK C A. Fifty years of Moore's law[J]. IEEE Transactions on semiconductor manufacturing, 2011, 24(2): 202-207. doi: 10.1109/TSM.2010.2096437
    WILLIAMSR S. What's next? [the end of Moore's law][J]. Computing in Science & Engineering, 2017, 19(2): 7-13.
    魏明, 张军. 一种便携式箱式电阻炉校准装置的研制[J]. 计量科学与技术, 2022, 66(12): 50-54. doi: 10.12338/j.issn.2096-9015.2022.0011
    HIKAVYY A, KRUV A, VAN OPSTAL T, et al. Investigation of C12 etch in view of extremely low temperature selective epitaxial processes[J]. Semiconductor Science and Technology, 2017, 32(11): 114006. doi: 10.1088/1361-6641/aa7e4b
    RAHAMAN S Z, WANG I J, CHEN T Y, et al. Pulsewidth and temperature effect on the switching behavior of an etch-stop-on-MgO-barrier spin-orbit torque MRAM cell[J]. IEEE Electron Device Letters, 2018, 39(9): 1306-1309. doi: 10.1109/LED.2018.2856518
    SCHIAVONE G, MURRAY J, PERRY R, et al. Integration of electrodeposited Ni-Fe in MEMS with low-temperature deposition and Etch processes[J]. Materials, 2017, 10(3): 323. doi: 10.3390/ma10030323
    PEJOVIC M M, RISTIC G S, MILOSAVLJEVIC C S, et al. Influence of tube wall material type and tube temperature on the recombination processes of nitrogen ions and atoms in afterglow[J]. Journal of Physics D:Applied Physics, 2002, 35(20): 25.
    YAMAMOTO H, KURODA H, ITO M, et al. Feature profiles on plasma etch of organic films by a temporal control of radical densities and real-time monitoring of substrate temperature[J]. Japanese Journal of Applied Physics, 2011, 51(1R): 16202.
    HUANG P, YANG H. A design method to improve temperature uniformity on wafer for rapid thermal processing[J]. Electronics, 2018, 7(10): 213. doi: 10.3390/electronics7100213
    TSAI B K, BODYCOMB J, DEWITI D P, et al. Emissivity compensated pyrometry for specular silicon surfaces on the NIST RTP test bed [C]. New York: IEEE, 2004.
    Kreider K G, DeWitt D P, Tsai B K, et al. Calibration Wafer for Temperature Measurements in RTP Tools [J]. Characterization and Metrology for ULSI Technology, 1998: 303-309.
    Engelmann J, Chu D, Dupraz T, et al. Measuring the wafer temperature in CVD tools using the wireless SensArray High Temp-400 wafer [J]. IEEE ASMC, 2017: 161-164.
    Mierden B, Tas M, Lof J, et al. ITRS roadmap is pushing wafer handling to milli-Kelvin performance [J]. International Conference of the European Society for Precision Engineering and Nanotechnology, 2017: 461-462.
    Fang F, Vaid A, Vinslava A, et al. Correlation study of actual temperature profile and in-line metrology measurements for within-wafer uniformity improvement and wafer edge yield enhancement[J]. SPIE Metrology, Inspection, and Process Control for Microlithography XXXII, 2018, 10585: 1-6.
    Kim J H, Koo Y, Song W, et al. On-Wafer Temperature Monitoring Sensor for Condition Monitoring of Repaired Electrostatic Chuck[J]. Electronics, 2022, 11(880): 1-10.
    范寒柏, 谢汉华. 基于NTC热敏电阻的三种高精度测温系统研究[J]. 传感技术学报, 2010, 23(11): 4.
    于丽丽, 王剑华, 殳伟群. NTC热敏电阻器在高精度温度测量中的应用[J]. 传感器技术, 2004(12): 75-77.
    Cheng A, Zhang Y, Zhao Y, et al. Design of Temperature Measurement System for Electric Vehicles Air Conditioning[J]. International Core Journal of Engineering, 2020, 6(1): 236-242.
    李婷, 汪洪军, 孙建平, 等. 海洋用NTC热敏电阻温度计校准方法探索[J]. 计量科学与技术, 2021, 65(5): 55-61. doi: 10.12338/j.issn.2096-9015.2020.9027
    Joung W, Gam K. Pearce J V. Pressure dependence of the reference deep-ocean thermometers[J]. Metrological Applications, 2020, 27(1): e1870.
    Guang Liu, Liang Guo, Chunlong Liu, et al. Evaluation of different calibration equations for NTC thermistor applied to high-precision temperature measurement[J]. Measurement, 2018, 120: 21-27. doi: 10.1016/j.measurement.2018.02.007
    White D R, Hill K, del Campo D, et al. Guide on secondary thermometry: Thermistor thermometry[R]. Bureau International des Poids et Mesures: Paris, France, 2014.
    梁亚星, 王秀峰, 金晓雪, 等. 氧化铝陶瓷材料电阻率精确测试方法[J]. 计量科学与技术, 2022, 66(1): 22-25.
    李超, 曾麟, 陈岳飞, 等. 恒温式量热仪校准精密温度计的可行性研究[J]. 计量科学与技术, 2022, 66(7): 38-44.
    王海涛, 文萌, 董亮, 等. 恒温槽温度梯度实验研究[J]. 计量科学与技术, 2021, 65(10): 50-53,5.
  • 加载中


    通讯作者: 陈斌, bchen63@163.com
    • 1. 

      沈阳化工大学材料科学与工程学院 沈阳 110142

    1. 本站搜索
    2. 百度学术搜索
    3. 万方数据库搜索
    4. CNKI搜索

    Figures(7)  / Tables(1)

    Article Metrics

    Article views (546) PDF downloads(141) Cited by()
    Proportional views


    DownLoad:  Full-Size Img  PowerPoint